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Step 1: Incoming damaged BGA
 
  • Solder balls removal
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  • Visual inspection
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    Step 2: Remove solders
     
  • Cleaning
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  • Baking for 24 hours
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  • Flux printing & re-balling
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    Step 3: After Re-Balling
     
  • Re-flow process
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  • QA inspection
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  • All test to follow IPC standards
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    Cost Savings
  • Save up to 90-95% of the BGA cost ( Re-balling cost will be 5-10% of the new BGA cost )
  • Reduce material inventory that can save millions of dollars a year.
  • shorter turn around time that can save operating cost and ensure on time delivery
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      Technical Aspect / Reliability for BGA after Re-Balling >  
      Advantages of Reballing BGA >